Temperature is an important factor which determines the reliability of an electronics system. Electronics systems are exposed to extreme and dusty environmental conditions. Thermal simulation of the systems is conducted and the components’ temperature is predicted. Suitable heat transfer mechanisms such as heatsinks, fan, vent etc., are designed to cool the electronics device; consequently to improve the reliability of the electronics system. Mechanical & Thermal Engineering Division (MTED), Chennai undertakes thermal design consultancy and thermal performance testing and evaluation of Electronic Systems from module level to system level. Over the last two decades, the division has addressed thermal design & analysis consultancy tasks for space, strategic, consumer and medical electronics systems working in various operating environments. This thermal analysis and temperature predictions are being carried out using simulation tools such as FloTHERM for thermal design of air cooled systems and UG NX for Thermal design of space and avionics systems. The test laboratory is equipped with state-of-the-art Airflow simulation chamber, Infrared Imaging system for non-contact temperature measurements and thermocouple based Instrumentation for contact temperature measurements. The division’s capabilities have been extended to industry and R&D institutions as a unique facility with the expertise achieved with the active involvement in handling challenging tasks of thermal design and offering viable solutions. Some of potential Indian industries whom thermal design and consultancy services have been provided are ISRO, DRDO, IIT Mumbai, ECIL, BEL, WIPRO, HCL and the list goes on.

 

Mechanical & Thermal Engineering Division (MTED), Chennai has been providing thermal simulation and analysis of spacecraft electronics packages and its sub-systems for the last two decades. Spacecraft and its sub-systems are exposed to extreme temperature conditions. Suitable thermal design techniques such as heatpipe, heatsink etc., are designed and deployed to maintain the electronics components within their specification limit.

 

Strategic electronics systems are exposed to very high ambient temperature conditions. Thermal simulation of the strategic electronics systems is conducted and the components’ temperature is predicted. Suitable heat transfer mechanism is adopted to cool the electronics device and to maintain the devices below 85oC.